Product Introduction - Array MEMS MIC Assembly - Shandong Gettop Acoustic Co., Ltd.

Product Introduction - Array MEMS MIC Assembly


        With FPC as a carrier, various choices of circuits and components can achieve different functions.
        The product components include resistor, capacitor, inductor, LED, switch, connector and MEMS (digital or analog) which can be designed  to meet different demands.
        Audio Enhancement Technologies: canceling noise and echo, automatically controlling gain, and supporting the voice capture in the long-distance talk
        Echo Canceling: canceling environmental noise and improving sound quality
        Noise Suppression: suppressing noise by cone-shaped audio band and improving sound quality
        Saving more space, simplifying circuit complexity,  bending randomly as required, and easy to assemble
        PC, Smartphone, and Camera, etc.